Er, sonicated in acetone for 30 min, and then washed with deionized bonding, isopropyl alcohol just before the Cu oxidation; therefore, acetic acid For CNT u water and it was critical to minimizeelectrochemical hemical reaction. treatment was employed. The essential to minimize Cu oxidation; for that reason, acetic acid treatment bonding, it was 4-aminophenyl diazonium cations generated in situ by the reaction of pphenylenediamine and NaNO2 in an acidic medium had been utilized because the precursor, which was employed. The 4-aminophenyl diazonium cations generated in situ by the reaction had been recognized to lower and NaNO reactive radical capable of bonding to metal surfaces of p-phenylenediamine to a highly 2 in an acidic medium had been utilised because the precursor, (Figure 2A) [591]. For CNT-Pt a highly reactive radical was electrochemically metal which were recognized to lower to bonding, ethylenediaminecapable of bonding to grafted on the (Figure 2A) acetonitrile CNT-Pt bonding, Sulfinpyrazone custom synthesis ethylenediamine by electrochemically surfacesPt surface in [591]. For as a solvent comparable to that reportedwas Segut et al. (Figure 2B) [62]. Herlem et al. has acetonitrile as a solvent related to that reported by Segut et al. grafted around the Pt surface inused a related electrochemical grafting reaction to modify metal electrodes [62]. Herlem et al. has employed Cyclic voltammetry at a grafting reaction s-1 (Figure 2B) with ethylenediamine [63,64]. a comparable electrochemicalscan rate of 50 mVto was utilized to electrodes with ethylenediamine [63,64]. Cyclic voltammetry at a scan rate modify metal identify the oxidative grafting of ethylenediamine on a Pt sheet electrode in acetonitrile was utilized to determine the oxidative grafting of ethylenediamine on a Pt sheet of 50 mV s-1with an Ag pseudo-reference electrode (Figure S1).electrode in acetonitrile with an Ag pseudo-reference electrode (Figure S1).Figure two. Proposed mechanism for the chemical bond formation between metals and open-ended CNTs. (A) In situ Figure 2. and attachment of an for the chemical bond to a Cu surface and subsequent bonding to CNTs. (A) In situ generation Proposed mechanism amine functional group formation among metals and open-ended a carboxylic acid generation and attachment of of CNT. functional group to a Cu surface and subsequent a Pt surface and subsequent functional group at the open end Mefenpyr-diethyl MedChemExpress anaamine (B) Electrochemical attachment of ethylenediamine tobonding to a carboxylic acid functional group at the open carboxylic acid (B) Electrochemical attachment of ethylenediamine to a Pt surface and bonding on the amine end for the finish of a CNT. at the open ends from the CNTs. subsequent bonding on the amine end to the carboxylic acid at the open ends with the CNTs.Subsequently, the amine-grafted metal surface and carboxylic-functionalized HD-CNT Subsequently, amine-grafted metal surface and carboxylic-functionalized HDcross-section within the film had been clamped together and heated to 80 C to promote a CNT cross-section inside the film weregroups [14]. reaction amongst the surface functional clamped together and heated to 80 to market a reaction involving the surface functional groups [14]. two.4. CNTs Bonded to Metal as a Operating Electrode two.4. ElectrochemicalMetal as a Working and electrical conductivity measurements from the CNTs Bonded to characterization Electrode chemically bonded CNTs to Cu metal had been performed conductivity measurements in the Electrochemical characterization and electrical on electrodes assembled as shown in Figure S2.bon.